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1、 Thermal design, as a special discipline, has successfully solved the problem of heat loss or retention in the equipment. In thermal design, it is often necessary to consider the heat conduction between power devices and heat sinks. The reasonable selection of heat transfer medium should not only consider its heat transfer capacity, but also take into account the process in production, maintenance and operation, and excellent cost performance.
1 Phase change thermal insulation material
Using the characteristics of the substrate, phase change occurs at the working temperature, which makes the material more close to the contact surface, and also obtains ultra-low thermal resistance, which can more thoroughly transfer heat. It is a reliable choice for CPU, module power supply and other important devices.
2 Thermal conductive gasket
The crystallization of special process and advanced technology, extraordinary thermal conductivity and low resistance are materials used in special occasions. Their thermal conductivity and the flexibility of the material itself meet the heat dissipation and installation requirements of power devices very well.
3 Heat conduction tape
Widely used in the bonding between power devices and radiators, it can simultaneously realize the functions of heat conduction, insulation and fixation, effectively reduce the volume of equipment, and is a favorable choice to reduce the cost of equipment.
4 Thermal insulation elastic rubber
With good thermal conductivity and high pressure resistance, it meets the requirements of the electronic industry for thermal conductivity materials. It is a binary powder that can replace the silicone grease thermal conductivity paste and mica sheet
The best product of thermal system. This type of product is easy to install, convenient for automatic production and product maintenance, and is a new type of material with high technology and practicability.
5 Flexible heat conduction pad
A kind of thick heat conduction liner is specially produced for the design scheme of using the gap to transfer heat. It can fill the gap and complete the heat transfer between the heating part and the heat dissipation part
At the same time, it can also play the role of shock absorption, insulation and sealing, and can meet the design requirements of equipment miniaturization and ultra-thin.
6 Heat conduction filler
It can also be used as heat transfer adhesive, which not only has the effect of heat transfer, but also is an excellent material for bonding, sealing and sealing. Through the filling of butt contact surface or can body,
Conducting heat from heating parts.
7 Thermal insulation potting adhesive
Thermal insulation potting adhesive is suitable for potting electronic components with high heat dissipation requirements. After curing, the adhesive has good thermal conductivity, excellent insulation and excellent electrical performance,
Good adhesion and surface gloss.
Jan 21, 2023
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