Microporous Board
MOQ<5TONS
MOQ: 100 pieces
Description
Microporous Board is a new type of heat insulation material made of silica particles with a diameter of tens of nanometers, combined with infrared light-blocking agents and fibers, and undergoes a series of physical and chemical reactions. Because it contains a large number of nano-scale micropores inside, it has excellent thermal insulation effect. Also known as nano board, nano insulation board, nano insulation board, super insulation material, nano composite insulation board, nano aerogel, nano microporous insulation material, etc.
The main components of the microporous nano board is nano silicon dioxide and silicon carbide. It is a new type of heat insulation material obtained after a series of physical and chemical reactions, consisting of silicon dioxide particles with diameters of tens of nanometers, and infrared sunscreens and fibers.
Features
1. microporous board is Small specific heat, low heat storage, and thermal shock resistance. Temperature resistance up to 1100°C
2. An ideal high-temperature thermal insulation material.
3.Good thermal stability, less heat storage, thermal shock resistance, and long service life.
4. Non-toxic and environmentally friendly
Application
Microporous board is suitable for applications where there are high requirements for thermal insulation and energy saving, or where there are restrictions on the thickness of thermal insulation materials. For example: iron and steel metallurgical equipment (ladle, tundish, torpedo tank); ceramic furnace (roller kiln, tunnel kiln); glass furnace (melting furnace, tempering furnace, launder); aluminum industry (melting furnace, holding furnace, Ladles); chemical equipment (cracking furnaces, high-temperature pipelines); electrical products (black boxes, thermometers, thermal storage electric heaters); fire doors (elevator landing doors, fire partitions) and other industry fields.
Physical And Chemical Indicators
Microporous board Properties |
TP950 |
TP1000 |
TP1100 |
|
Melting Point (℃) |
≥1200 |
≥1200 |
≥1200 |
|
Operating Temperature (℃) |
950 |
1000 |
1100 |
|
Density (kg/m³) |
280-350 |
550-650 |
550-650 |
|
Compressive strength (MPa) |
0.5 |
0.8-1.2 |
0.8-1.2 |
|
800℃ Heating wire shrink 800℃ (%) |
≤1.9 |
≤1.9 |
≤1.9 |
|
Thermal Conductivity (w/m.k)
|
200℃ |
0.016 |
/ |
/ |
|
400℃ |
0.021 |
0.043 |
0.047 |
|
600℃ |
0.026 |
0.057 |
0.058 |
|
800℃ |
0.035 |
0.063 |
0.069 |
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