Application Field Of Thermal Conductive Materials

1 Thermal conduction of semiconductor devices;
2 Heat conduction in power generation equipment and most power supply equipment and power module
5、 Heat conduction tape
Heat conduction tape is widely used in the heat conduction design of heating devices such as CPU, power tube, module power supply, etc. It can completely replace the application of traditional silicone grease and transfer heat efficiently and conveniently. The heat conduction tape uses high heat conduction rubber as the heat conduction base material, and has pressure-sensitive heat conduction adhesive on one or both sides, which is reliable in adhesion and high in strength. The thermal conductive tape is thin and flexible, which is very easy to fit the surface of devices and radiators. The thermal conductive tape can also adapt to the changes of cold and hot temperatures to ensure consistent and stable performance.
Application:
The pressure-sensitive back adhesive of thermal conductive tape has high adhesive strength and excellent thermal conductivity. It can bond and fix devices and radiators to achieve heat conduction, insulation and fixation. It is especially suitable for occasions with high integration, small equipment space, and difficult fixation. It is a suitable material for reducing the volume of heat dissipation accessories and optimizing design.
usage method:
Pay attention to the operation method when bonding the thermal conductive double-back adhesive tape. It is strictly forbidden to touch the surface with hands or other non-adhesive materials. It is strictly forbidden to repeatedly peel it. The surface to be bonded should be kept clean and dry. Generally, clean it with alcohol before use to avoid affecting the bonding fastness. Auxiliary supplies: cotton cloth, industrial cleaner, rubber gloves.
Step 1: Wipe the surface of the device with a lint-free cotton cloth.
Step 2: Wipe the surface of the device with a cotton cloth soaked in industrial cleaner to remove oil stain; In addition, do not touch the clean surface during installation.
Step 3: Tear off the protective film on one side of the back glue, and do not touch the glue surface with your fingers.
Step 4: paste it on the surface of the device, and press it gently from the center of the bonding area to the periphery for five seconds to ensure that the double-back adhesive tape is fully 100% contact with the surface of the heat dissipation device.
Step 5: tear off the protective film on the other side of the back adhesive, and follow the same method in Step 3 and Step 4 to make the adhesive between the double back adhesive tape and the chip firm.
6、 Flexible heat conduction pad
Flexible heat conduction pad is a kind of heat conduction pad with thickness. The base materials used are basically silicone rubber and foam rubber. The silicone rubber is characterized by good elasticity, while the foam rubber is characterized by large deformation range, good heat conduction effect and higher pressure resistance. The flexible heat conduction pad is often used as a filler in a large gap to transfer heat. It is usually used between PCBs, between PCBs and enclosures, between power devices and enclosures, or just pasted on the chip as a heat sink (in this case, corrugated ones are generally used). The thermal conductive filler particles in the flexible thermal conductive pad are generally aluminum oxide particles or mixed particles of aluminum oxide, magnesium oxide and boron nitride. They have good thermal conductivity and can prevent puncture. They really play an insulating role.
Application: heat pipe assembly, RDROMTM memory module, CDROM cooling, between CPU and heat sink, any occasion where heat needs to be transferred to shell, chassis or other heat sinks
usage method:
Prepare auxiliary supplies: cotton cloth, industrial cleaner, rubber gloves.
Step 1: Wipe the surface of the device with a lint-free cotton cloth.
Step 2: Wipe the surface of the device with a cotton cloth soaked in industrial cleaner to remove oil stain.
Step 3: Tear off the protective film on one side of the back glue, and do not touch the glue surface with your fingers.
Step 4: Lightly press the flexible heat conduction pad to ensure firm bonding.